The Navy ManTech Power Packaging Lab – located within ACI Technologies in Philadelphia, Pennsylvania – was designed to provide advanced packaging and electronics manufacturing capabilities such as die attach and wire bonding. The Power Packaging Lab is part of the Navy’s National Center of Excellence in Electronics Manufacturing: The EMPF (Electronics Manufacturing Productivity Facility).

The objective of this project is to develop a low-cost friction stir welding machine and to demonstrate its operation at a shipyard supporting the Lockheed Martin Team LCS construction. Working with the project Integrated Project Team (IPT), the Navy Metalworking Center (NMC) designed, built, and demonstrated a transportable friction stir welding system that will be transitioned to production use at the shipyard.

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