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Fuel Cell Manufacturing Manhattan Project
(December 2011)
ACIT announces the completion of the Fuel Cell Manufacturing Manhattan Project

Fuel Cell Manufacturing Manhattan Project Phase II
(March 2011)
ACIT announces the commencement of the Fuel Cell Manufacturing Manhattan Project II...

Featured Best Practice
(November 2010)
Introduction to the EMPF Power Packaging Laboratory's 3D Packaging: Package on Package Technology...

Fuel Cell Manufacturing Manhattan Project
(September 2010)
ACIT announces the commencement of the Fuel Cell Manufacturing Manhattan Project...


Featured Best Practice
Navy Metal Working Center (NMC) project featured on B2P site...


New Articles added to B2P Portal
New articles focused on Lead Free manufacturing have been added to the B2P Knowledge Portal...


Lead Free Electronics Manhattan Project Publication
The Office of Naval Research has endeavored to initiate the sponsorship of the electronic Pb-free Manhattan Project, as an appropriate response to the very serious challenges that lie ahead for both the Military and Industry

 

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3D Packaging: Package on Package Technology

Electronics Manufacturing Productivity Facility (EMPF)

The electronics industry is continually developing new and advanced manufacturing processes as products become more complex. One such electronics manufacturing technology is called 3D Packaging. Traditional circuit board manufacturing consists of placing singular electronic components on a bare printed wiring board (PWB). The concept of 3D Packaging is to grow circuit boards upward rather than outward. One emerging 3D Packaging technology is called Package on Package technology (PoP). PoP places electronic components on top of one another into stacks on the PWB. PoP enables smaller, lighter circuit board assemblies with more complex capabilities.

The Navy ManTech Power Packaging Lab – located within ACI Technologies in Philadelphia, Pennsylvania – was designed to provide advanced packaging and electronics manufacturing capabilities such as die attach and wire bonding. The Power Packaging Lab is part of the Navy’s National Center of Excellence in Electronics Manufacturing: The EMPF (Electronics Manufacturing Productivity Facility). The Power Packaging Lab also has Package on Package capabilities and is equipped to handle small production runs, prototype builds, and process development work.


The EMPF is operated by ACI Technologies, Inc.
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